Supermicro Motherboards

Supermicro Motherboards

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SERVER BOARD X11DDW-NT

SUPERMICRO

Rp0

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Key Features   1.     2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s 2.     Intel® C622 3.     Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only). 4.     1 PCI-E 3.0 x32 Left Riser Slot, 1 PCI-E 3.0 x16 Right Riser Slot, 1 PCI-E 3.0 x16 for Add-On-Module (AOM) M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2242, 2260, 2280, 22110 M.2 Key: M-Key U.2 Interface: PCI-E 3.0 x4, 4 PCI-E 3..

SERVER BOARD X11DGQ

SUPERMICRO

Rp0

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Key Features   1.     2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s 2.     Intel® C621 3.     Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only) 4.     4 PCI-E 3.0 x16, 1 PCI-E 3.0 x32 Riser Slot M.2 Interface: 1 PCI-E 3.0 x4 M.2 Form Factor: 2242, 2260, 2280 M.2 Key: M-Key M.2 type: SATA and NVMe 5.     Intel® C621 controller for 4 SATA3 (6 Gbps) ports; RAID 0,1,5,10 6...

SERVER BOARD X11DPG-QT

SUPERMICRO

Rp0

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Key Features   1.     2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP, 3 UPI up to 10.4 GT/s 2.     Intel® C621 3.     Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only). 4.     6 PCI-E 3.0 x16, 1 PCI-E 3.0 x4 (in x8 slot) M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-Key 5.     Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10 6.   ..

SERVER BOARD X11DPH-i

SUPERMICRO

Rp0

Ex Tax: Rp0

Key Features   1.     2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s 2.     Intel® C621 3.     Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only); 4.     3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 M.2 Interface: 2 PCI-E 3.0 x4 M.2 Form Factor: 2242/2260/2280/22110 M.2 Key: M-Key (RAID 0,1 support) 5.     1 VGA port 6.     Intel® C621 controller for 10 SATA3 ..

SERVER BOARD X11DPH-T

SUPERMICRO

Rp0

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Key Features   1.     2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s 2.     Intel® C622 3.     Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only); 4.     3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 M.2 Interface: 2 PCI-E 3.0 x4 M.2 Form Factor: 2242/2260/2280/22110 M.2 Key: M-Key (RAID 0,1 support) 5.     1 VGA port 6.     Intel® C622 controller for 10 SATA3 (6 Gb..

SERVER BOARD X11DPH-Tq

SUPERMICRO

Rp0

Ex Tax: Rp0

Key Features   1.     2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s 2.     Intel® C627 3.     Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only); 4.     3 PCI-E 3.0 x16, 3 PCI-E 3.0 x8 M.2 Interface: 2 PCI-E 3.0 x4 M.2 Form Factor: 2242/2260/2280/22110 M.2 Key: M-Key (RAID 0,1 support) 5.     1 VGA port 6.     Intel® C627 controller for 10 SATA3 (6 Gb..

SERVER BOARD X11DPi-N

SUPERMICRO

Rp0

Ex Tax: Rp0

Key Features   1.     2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s 2.     Intel® C621 3.     Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz Or 2TB DCPMM, DDR4-2666MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only); 4.     4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key, 2 PCI-E 3.0 NVMe x4 Internal Port(s) 5.     1 VGA port 6.  &n..

SERVER BOARD X11DPi-NT

SUPERMICRO

Rp0

Ex Tax: Rp0

Key Features   1.     2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s 2.     Intel® C622 3.     Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz Or 2TB DCPMM, DDR4-2666MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only); 4.     4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key, 2 PCI-E 3.0 NVMe x4 Internal Port(s) 5.     1 VGA port 6.  &n..

SERVER BOARD X11DPL-i

SUPERMICRO

Rp0

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Key Features   1.     2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s 2.     Intel® C621 3.     Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots 4.     2 PCI-E 3.0 x16, 3 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8 slot) M.2 Interface: 1 SATA/PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280 M.2 Key: M-Key 5.     1 VGA port 6.     Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10 7.     Dual LAN with Lew..

SERVER BOARD X11DPT-PS
New

SUPERMICRO

Rp0

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SERVER BOARD X11DPX-T

SUPERMICRO

Rp0

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Key Features   1.     2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP, 3 UPI up to 10.4 GT/s 2.     Intel® C621 3.     Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only). 4.     2 PCI-E 3.0 x16, 8 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8 slot) Or 4 PCI-E 3.0 x16 and 4 PCI-E 3.0 x8 and 1 PCI-E 3.0 x4 (in x8 slot) M.2 Interface: 1 PCI-E 3.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-Key 5.     ..

SERVER BOARD X11DSC
New

SUPERMICRO

Rp0

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Key Features2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/sIntel® C621Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).Intel® C621 controller for 4 SATA3 (6 Gbps) ports; RAID 0,1,5,10Intel® Node Manager, IPMI (Intelligent Platform Management Interface) v2.0 with KVM support, KVM with dedicated LAN, NMI, SPM, SSM, SUM, SuperDoctor® 5, Watchdog2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x8+x8 for SAS3 Add-On-Module4 PCI-E 3.0 NVMe x4 Internal Port(s)..

Workstation Boards X11SRA
New

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Rp0

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Product SKUs MBD-X11SRA ·         X11SRA     Physical Stats Form Factor ·         ATX Dimensions ·         12" x 9.6" (30.48cm x 24.38cm)     Processor/Cache CPU ·         Intel® Xeon® Processor Skylake-W . ·    ..

Showing 1 to 13 of 13 (1 Pages)